Your-message-sent: Fri, 12 Apr 91 11:00:29 CDT Your-Message-ID: <9104121600.AA18924@stephens.tisl.ukans.edu> MOSIS-Message-ID: imlr-00066361-91041209014800 MOSIS-Reply-Posted-for-Delivery: 12 April 1991 9:07:25 Dear MOSIS User: Here are the MOSIS prices through February 28, 1991. PRICE SCHEDULE A: To be used if your organization is submitting a purchase order to MOSIS. PRICE SCHEDULE B: To be used if your account is sponsored by DARPA or NSF (no purchase order involved). If you have any questions about these prices please contact Kathleen Fry at or (213) 822-1511. PLEASE NOTE: The last page of this document pertains to BOTH price schedules and contains information on project size, assembly, additional parts and production orders. PRICE SCHEDULE A FOR ORGANIZATIONS SUBMITTING PURCHASE ORDERS TO MOSIS (prices valid through June 30, 1991) ------------------------------------------------------------------------------ | TECHNOLOGY MAXIMUM PROJECT MINIMUM TOTAL ADDITIONAL | | SIZE (MM) QUANTITIES PRICE PARTS | ------------------------------------------------------------------------------ | PRICED PER PROJECT: | | | | CMOS 2.22 x 2.25 4 $ 500 500 (4 parts)| | 2.0um 4.6 x 6.8 12 $ 2,500 $ 1,670 (8 parts)| | 6.9 x 6.8 24 $ 5,400 $ 1,800 (8 parts)| | 7.9 x 9.2 32 $ 10,900 $ 2,730 (8 parts)| ------------------------------------------------------------------------------ ------------------------------------------------------------------------------ | PRICE PER MINIMUM PACKAGING | TECHNOLOGY SQ MM LOT COST PER PART ------------------------------------------------------------------------------ | PRICED PER SQUARE MILLIMETER: | | | | CMOS | | 1.6um $ 500 50 * $20 for DIPS (28-64 pins) | | | | 1.2um $ 650 50 * $40 for PGAs (84-132 pins) | | ****************************** | | Gallium $ 650 30 * $50 for LDCCs (28 & 52 pins) | | Arsenide * $85 for LDCCs (132 pins) | | | | PLEASE DO YOUR 1.6UM, 1.2UM AND GAA'S PROJECT AREA CALCULATION IN MICRONS, | | converting the result into square millimeters which you have carried out | | to three decimal places. The price should be rounded to the nearest | | dollar (see example below). | | | | The minimum charge is based on the smallest frame size distributed by | | MOSIS for each process. The frames are: 2.22x2.25mm for 1.6um and GaAs; | | 1.94x1.94mm for 1.2um projects. A sample minimum charge calculation for | | 50 packaged 1.6um parts is: | | | | (2.22mm)*(2.25mm)=4.995 sq. mm:[(4.995 sq.mm)*($500/sq.mm)]+$2,000=$4,498 | | | ------------------------------------------------------------------------------ PLACING AN ORDER: (Price Schedule A) The first time you place an order with MOSIS, please fill out two copies of our customer agreement (copies available from MOSIS). BOTH copies of the agreement should be signed by your authorized representative and returned to us. We will sign them and return one signed original to you. MOSIS must have a hardcopy purchase order before proceeding with fabrication. Please send the purchase order to: KEVIN STEPHENS, THE MOSIS SERVICE, USC/ INFORMATION SCIENCES INSTITUTE, 4676 ADMIRALTY WAY, MARINA DEL REY, CA 90292-6695. Payment terms are net 30 days; prices include shipping costs. PLEASE NOTE: Packaged parts will be sent to the shipping address listed on the purchase order. Please make sure the shipping address on the purchase order is correct. MOSIS accepts designs in CIF, GDS II and MEBES format. You may send your layout geometry by electronic mail (instructions are outlined in the MOSIS User Manual) or on a magnetic or cartridge tape via regular mail. Magnetic tapes must be accompanied by a completed MOSIS Project Submission Form (available from MOSIS). Tapes and accompanying paperwork are to be sent to SAM REYNOLDS, THE MOSIS SERVICE, USC/INFORMATION SCIENCES INSTITUTE, 4676 ADMIRALTY WAY, MARINA DEL REY, CA 90292-6695. Tapes must be received by MOSIS at least 48 hours before a run is scheduled to begin. PRICE SCHEDULE B TO BE USED FOR NSF AND DARPA SPONSORED ACCOUNTS IF NO PURCHASE ORDER IS INVOLVED (prices valid through June 30, 1991) ------------------------------------------------------------------------------ | TECHNOLOGY MAXIMUM PROJECT MINIMUM TOTAL ADDITIONAL | | SIZE (MM) QUANTITIES PRICE PARTS | -----------------------------------------------------------------------------| | PRICED PER-PROJECT: | | | | CMOS 2.22 x 2.25 4 $ 440 440 | | 2.0um 4.6 x 6.8 12 $ 2,280 $ 1,520 (8 parts)| | 6.9 x 6.8 24 $ 5,040 $ 1,680 (8 parts)| | 7.9 x 9.2 32 $ 10,280 $ 2,570 (8 parts)| ------------------------------------------------------------------------------ ------------------------------------------------------------------------------ | PRICE PER MINIMUM PACKAGING | TECHNOLOGY SQ MM LOT COST PER PART ------------------------------------------------------------------------------ | PRICED PER SQUARE MILLIMETER: | | | | CMOS | | 1.6um $ 390 50 * $20 for DIPS (28-64 pins) | | | | 1.2um $ 560 50 * $40 for PGAs (84-132 pins) | | ****************************** | | Gallium $ 580 30 * $50 for LDCCs (28 & 52 pins) | | Arsenide * $85 for LDCCs (132 pins) | | | | PLEASE DO YOUR 1.6UM, 1.2UM AND GAA'S PROJECT AREA CALCULATION IN MICRONS, | | converting the result into square millimeters which you have carried out | | to three decimal places. The price should be rounded to the nearest | | dollar (see example below). | | | | The minimum charge is based on the smallest frame size distributed by | | MOSIS for each process. The frames are: 2.22x2.25mm for 1.6um and GaAs; | | 1.94x1.94mm for 1.2um projects. A sample minimum charge calculation for | | 50 packaged 1.6um parts is: | | | | (2.22mm)*(2.25mm)=4.995 sq. mm:[(4.995 sq.mm)*($500/sq.mm)]+$2,000=$4,498 | | | ------------------------------------------------------------------------------ PLACING AN ORDER: (Price Schedule B) If your MOSIS account is sponsored by DARPA or NSF your designs must be sent to MOSIS over electronic mail. If you wish to send tapes this must be authorized in advance by DARPA or NSF. Tapes must be accompanied by a completed MOSIS Project Submission Form (available from MOSIS). Tapes and accompanying paperwork are to be sent to SAM REYNOLDS, THE MOSIS SERVICE, USC/INFORMATION SCIENCES INSTITUTE, 4676 ADMIRALTY WAY, MARINA DEL REY, CA 90292-6695. Tapes must be received by MOSIS at least 48 hours before a run is scheduled to begin. THIS INFORMATION APPLIES TO BOTH PRICE SCHEDULES PROJECT SIZE: MOSIS adds Scribe lanes and other overhead to the submitted geometry. Please do not include these items in your design. Your die size will be determined by MOSIS to fit both your packaging needs and our wafer packing requirements. If the exact die size is critical for your application, please contact Sam Reynolds at (213) 822-1511. ASSEMBLY: MOSIS offers ceramic packages in 28, 40 and 64 pin DIPs and 84, 108 and 132 PGAs for CMOS designs; 28, 52 and 132 LDCCs are available for GaAs projects. You may also supply your own packages or request that your parts be unpackaged. Lids on all projects will be taped unless you request hermetic sealing. TinyChip die are limited to the 28 and 40 pin DIPS; MOSIS will do a bondability check on TinyChip projects to 1) confirm that the number of pads is 40 or less and 2) make sure a bonding diagram can be generated automatically by MOSIS. NOTE TO ONLINE USERS: When submitting TinyChip projects, remember to use the 'TINY-' prefix, i.e., 'TINY-SCN'. If the pin count or performance of the packages stocked by MOSIS is inadequate for your application, please call Wes Hansford at (213) 822-1511 to discuss your special requirements. Our fabricator stock a large variety of characterized packages for their internal high performance and high pin-out applications. *************************************************************** If you provide a custom binding diagram, it MUST ACCOMPANY your Project Submission Form (offline users) or it MUST BE RECEIVED by Sam Reynolds BEFORE the scheduled run-closing date (online users). FAILURE TO DO THIS MAY RESULT IN UNPACKAGED PARTS. PLEASE NOTE: If you supply your own packages, they MUST BE RECEIVED by MOSIS by Friday of the scheduled run-closing week. REMEMBER to send package lids. **************************************************************** 2.0 Micron Technologies: The total price for these projects includes packaging. You may request unpackaged parts or provide your own packages, however, the price does not change for these options. 1.6, 1.2 Micron and GaAs Technologies: The price per square millimeter for these projects does NOT include packaging costs which are determined according to the number of pins in the package. If you supply your own packages, the cost is $15 per package for the DIPS and $25 per package for the PGAs and LDCCs. ADDITIONAL PARTS AND PRODUCTION ORDERS: If you wish to order more than the minimum quantity of 2.0 micron parts, please request the desired additional parts in your initial order. These extra parts must be ordered (and are priced) in increments of eight, except for TinyChips which must be ordered in lots of four. To place an order for an entire wafer lot of a single die type or for larger quantities of 1.6, 1.2 or GaAs technologies, contact Kathleen Fry at (213) 822-1511; jobs will be quoted on an individual basis. ADDITIONAL INFORMATION: For further information, contact the following MOSIS staff at (213) 822-1511 or by network mail. Order Information: Kevin Stephens STEPHENS@MOSIS.EDU General Information: Sam Reynolds SDREYNOLDS@MOSIS.EDU Documentation Requests: Christine Tomovich TOMOVICH@MOSIS.EDU