TINYCHIP PROJECTS

			The MOSIS Service


Contents:

I.   Intro
II.  3um TinyChip
	A. Specifications
	B. Project Submission
III. 2um TinyChip 
	A. Specifications
	B. Project Submission

*********
I.  Introduction 

The MOSIS Service is offering a new standard die size, called TinyChip
which is now available at 2um as well as 3um. Four packaged parts of
3um feature size cost $550; four packaged parts of 2um cost $500.

TinyChip projects are now available on all MOSIS runs with the 3um TinyChip]
in CMOS P-well technology and the 2um in CMOS N-well and P-well.

Tinychips can now be packaged when a standard frame is NOT used as long as the
number of pads is 40 or less. If you use the PADS and SIZE option, MOSIS will
do a bondability check when the project is submitted to 1) confirm that the
number of pads is 40 or less, and 2) make sure a bonding diagram can be
generated automatically by MOSIS.  Projects will be packaged as follows:

	1 - 28 pads:	28 pin DIP
	29 - 40 pads:	40 pin DIP
	0 pads:		Parts will not be packaged
	More than 40 pads:	MOSIS will ask designer to resubmit project
				with 40 pads or less. 

**NOTE:  Your TinyChip projects MUST be submitted with the required
         TinyChip parameters to be fabricated and charged correctly
         as TinyChips.  The requisite submission parameters are covered
	 in the 'Project Submission' sections of this document.

TinyChip spares are not shipped to customers because the low cost 
of TinyChips does not allow us to have the packager sort the extra chips.


	 	    COST FOR SINGLE PROJECT (PACKAGED)*
	========================================================
		     MAXIMUM PROJECT
	TECHNOLOGY     SIZE (mm) 	QUANTITIES	 PRICE
	========================================================
	CMOS 3um 	2.3 x 3.4	      4 	  $550
	TinyChip

	CMOS 2um	2.22 x 2.25	      4           $500
	TinyChip
	========================================================
*  Please see the online Price Schedule for non-commercial prices.

II. 3um TinyChip

IIA. Specifications

The available design area is 2.3 x 3.4 millimeters. A 3um TinyChip
project MUST be CMOS/Bulk, P-well, double metal technology and must be
designed using the following:

		a. MOSIS' 3um design rules (scalable OR nonscalable), 
		   generic process specification and corner SPICE decks.

		b. Either the MOSIS Standard Frame (40PC22X22) or the
		   PADS and SIZE option (see 'Introduction').

To get a copy of the TinyChip Pads Set as well as CIF and documentation files
for the TinyChip Pad Frame pad locations, send a REQUEST message in the 
following format to MOSIS@MOSIS.EDU:

		REQUEST: LIBRARY
		LIBRARY: SCP30_PADS
		FILE: SCP30_PADS.CIF, SCP30_PADS.DOC
		FILE: 28P23x34.CIF
		REQUEST: END

For more information on MOSIS Standard Frames, request the following:

		REQUEST: INFO
		TOPIC: PACK_BOND
		REQUEST: END		

An OPTIONAL ('Stuffed') frame can also be used:

		a. 'Stuffed' standard frame with 26 pre-placed I/O pad
		   drivers, plus one power, one ground.  This frame is 
		   optional and is available only for projects designed to the
		   MOSIS scalable CMOS design rules.

IIB. Submitting your 3um TinyChip Project to MOSIS

Three micron projects designed with the scalable rules must have
'TINY-SCP' (or 'TINY-SCG' or 'TINY-SCE') in their NEW-PROJECT request:

		TECHNOLOGY: TINY-SCP
		LAMBDA: 1.5
		STD_FRAME: 28PC23X34

III. 2um TinyChip Projects

IIIA. 2um TinyChip Specifications

2um TinyChip must be designed with MOSIS scalable rules. The 2um TinyChip 
project size is 2220X2250 microns. 

MOSIS' Stuffed Frame is available in the same style as the 3um padframe.  
MOSIS has defined a 2um TinyChip padframe which has 40 pads rather than
the 3um's 28 pads. To obtain this frame, use the following syntax:

		REQUEST: LIBRARY
		LIBRARY: SCN20_PADS
		FILE: SCN20_PADS.DOC, 40PC22X22_STUFFED.CIF
		FILE: 40PC22X22_STUFFED_ANALOG.CIF
		REQUEST: END

Padframe information for P-well can be obtained in the same format, replacing
"SCN" with "SCP" in your message, e.g., SCP20_PADS. To get a CIF plot and
list of pad locations of the MOSIS 2um TinyChip Frame, send a message as
follows:

		REQUEST: LIBRARY
		LIBRARY: STD_FRAMES
		FILE: 40PC22X22.CIF, 40PC22X22.LIST
		REQUEST: END


IIIB. 2um TinyChip Project Submission

NEW-PROJECT submissions MUST contain the following parameters in order to be
fabricated as packaged TinyChips:

		TECHNOLOGY: TINY-SCE  (or TINY-SCN or TINY-SCP)
		LAMBDA: 1.0
		STD-FRAME: 40PC22X22 (or PADS/SIZE option)



The MOSIS Service
11/1/89