Date: 8 December 1990 9:36:56 From: The MOSIS System (send requests to MOSIS@MOSIS.EDU) Subject: Topic: Library: STD_FRAMES, File: STANDARD-FRAMES.INF To: evans@wiener.tisl.ukans.edu THE MOSIS SERVICE Rev100787/ct Standard project frames ----------------------- The MOSIS Service offers standard frames as an alternative to custom project frames where every project pad layout is unique. A standard project frame is a rectangular area of a fixed size and with a fixed set of bonding pad locations around the periphery of the rectangle. The circuitry in the remainder of the frame, the routing of pad connections, and the choice of pad types at each of the fixed locations are up to the user. The use of standard frames has numerous advantages over custom frames to both the MOSIS service and the user community: 1. The bonding of projects in standard frames is always the same for a given frame; therefore, packaging is both faster and more reliable. 2. Designers using standard frames determine their own package pin-out. 3. The future MOSIS pad routing service, FUSION, will support automatic pad routing to the standard frame chosen. 4. The future MOSIS functional testing service will provide probe cards for the standard frames; projects in custom frames will have to create their own private probe cards. The Frames ---------- Standard frames are available in six sizes and four different pad counts, for a total of eleven standard frames as listed in the table below. The matrix shows the official "name" assigned to each frame offered. Each frame size represents the total area available to the user for project geometry; all scribe lanes, markings, and other manufacturing and processing details are added by MOSIS outside this frame. PLEASE NOTE: These standard pad frames files - .LIST and .CIF - are for illustrative purposes ONLY and are to be used ONLY to determine pad placement. Virtual, not real layers are used in the .CIF file. Frame ----------------Package--------------- (microns) 28 40 64 84 ------------ 7900 x 9200 -- -- 64P79X92 84P79X92 6900 x 6800 -- 40P69X68 64P69X68 84P69X68 4600 x 6800 -- 40P46X68 64P46X68 -- 4600 x 3400 28P46X34 40P46X34 -- -- 2300 x 3400 28P23X34 -- -- -- 1900 x 2558 -- ParcBasic -- -- The 28-and 40-pin packages are both 0.6" wide DIPs; the 64-pin package is a 0.9" DIP; the 84-pin package is a pin grid array. The pad layout of each standard frame, other than "ParcBasic", has one-fourth of the pads evenly spaced along each side. "ParcBasic" is taken directly from the Basic Design Frame that was conceived at Xerox PARC (see "The Design of a Basic Design Frame" by Alan Paeth, available from XeroxPARC); this layout corresponds to the design frame at lambda equals 2.0 microns. The following table characterizes the pad layouts in terms of three parameters; the units are microns. Pad-to-Edge the distance from the center of each pad to the adjacent frame boundary. Pad-to-Edge is intended to be sufficient to accommodate the pad itself and a ground bus around the outside; the minimum pad-to-edge value is sufficient to accommodate MOSIS standard library pads. Pad-to-Pad the (center to center) distance between pads along an edge. The minimum value is 256 microns (for the next round of larger packages, the spacing will necessarily decrease to about 200 microns or so). Pad-to-Corner the distance from the center of the first/last pad on an edge to the corner of the frame. Where there is sufficient room, a minimum corner spacing of 750 microns is maintained. The first number, pad-to-edge, is the same for all the pads in a frame, but the other two are set separately for each pair of sides. The described orientation has N(orth) corresponding to the +Y direction of the Cartesian coordinate system used in CIF, E(ast) to the +X direction, W(est) to the -X direction, and S(outh) to the -Y direction. Frame -----N/S----- -----E/W----- (Name) Edge Pad Corner Pad Corner --------- --- --- --- --- --- ParcBasic 140 (none) 272 480,174 28P23X34 150 256 382 300 800 28P46X34 150 500 800 300 800 40P46X34 150 300 950 256 548 40P46X68 150 300 950 500 1150 64P46X68 150 256 380 300 1150 40P69X68 200 500 1200 500 1150 64P69X68 200 300 1200 300 1150 84P69X68 200 300 450 300 400 64P79X92 250 400 950 500 850 84P79X92 250 300 950 375 850 These numbers are reflected in the CIF and LIST files described below. All the pads of a standard frame project are bonded to the package pads in a fixed pattern. ParcBasic has its sixteen pads bonded into a 40- pin DIP according to the drawing in the design paper. The other DIP frames number pads beginning at #1, which is at, or immediately above, the center of the E(ast) or +X side, and proceeding counterclockwise around the frame. The pin grid array frames locate pad #1 at the E(ast) end of the N(orth) side and proceed counterclockwise, terminating at the N(orth) end of the E(ast) side. The CIF files distributed by MOSIS highlight pin #1. Note that MOSIS will connect one of the package pins to both the silicon substrate and its associated project pad. For the 28, 40, and 64 pin DIPs, the substrate connection is made on pin #1; for the 84 pin PGA, it is on pin #10, which is near the middle of the N(orth) side. Note that the TinyChip frame, 28PC23X34 does NOT have a substrate. Procedures for using standard frames ------------------------------------ To use a standard frame, the user must: 1. acquire from MOSIS (or derive from the table above) a description of the frame(s) of interest; 2. integrate that description into a design (i.e., put the pads at the right places); 3. inform MOSIS of the standard frame that is associated with a submitted project. Standard frame descriptions are available from MOSIS in two forms: (1) a CIF file (framename.CIF) that draws the bonding pads and the frame outline and highlights pad #1, and (2) a text file (framename.LIST) that lists the bonding pad centers, one per line. These files may be obtained via an information request to MOSIS. For example, the files for 28P23X34 are obtained with the following request: REQUEST: INFO TOPIC: 28P23X34.CIF TOPIC: 28P23X34.LIST When submitting to MOSIS a project using a standard frame, the parameter "STD-FRAME" is mandatory; it may be included in any of the NEW-PROJECT, SUBMIT, FABRICATE, or UPDATE requests. The argument to STD-FRAME is the frame name, for example: STD-FRAME: 28P23X34 A project in a standard frame cannot specify a "PADS" parameter and need not specify a "SIZE" parameter. The MOSIS CIF check for a standard frame project will include a check that the project is not larger than the size of the declared frame and that ALL the pads of the frame are indeed present. The minimum acceptable pad geometry is a 90 x 90 micron glass cut box over a 100 x 100 micron metal box, centered at the designated pad location. A pad may be larger and/or off-center, provided that it completely covers the minimum geometry. Project geometry may touch the frame boundary; MOSIS will provide appropriate separation between adjacent frames. However, when a project is smaller than the frame size, MOSIS will figure the best fit match between the actual project pads and those expected for the frame. There is no requirement anywhere that a project be specified in terms of an absolute CIF origin. All sizes and positions are relative to an arbitrary project origin. Following is a sample CIF file: ( 28P23X34.CIF -- MOSIS standard frame with 28 pads (7 per side) in a 2300 x 3400 micron project frame. Side: 2300 3400 N/S E/W ---- ---- Pad-to-Pad: 256 300 Pad-to-Corner: 382 800 Pad-to-Edge: 150 ); DS 1 100/1; (one minimum bonding pad, center at 0,0); L NM; B 100 100 0 0; L NG; B 90 90 0 0; DF; DS 3 100/1; (pad #1, marked for visibility); C 1; L NX; W 4 -35 10 5 10; W 4 -35 -10 5 -10; W 4 -25 20 -25 -20; W 4 -5 20 -5 -20; W 4 15 30 25 30 25 -30; W 4 15 -30 35 -30; DF; DS 2 100/1; L NX; B 2300 3400 1150 1700; (The frame, from 0,0 to 2300,3400); ( east side -- ); C 3 T 2150 1700; (pin #1 -- the substrate connection); C 1 T 2150 2000; (pin #2); C 1 T 2150 2300; (pin #3); C 1 T 2150 2600; (pin #4); ( north side -- ); C 1 T 1918 3250; (pin #5); C 1 T 1662 3250; (pin #6); C 1 T 1406 3250; (pin #7); C 1 T 1150 3250; (pin #8); C 1 T 894 3250; (pin #9); C 1 T 638 3250; (pin #10); C 1 T 382 3250; (pin #11); ( west side -- ); C 1 T 150 2600; (pin #12); C 1 T 150 2300; (pin #13); C 1 T 150 2000; (pin #14); C 1 T 150 1700; (pin #15); C 1 T 150 1400; (pin #16); C 1 T 150 1100; (pin #17); C 1 T 150 800; (pin #18); ( south side -- ); C 1 T 382 150; (pin #19); C 1 T 638 150; (pin #20); C 1 T 894 150; (pin #21); C 1 T 1150 150; (pin #22); C 1 T 1406 150; (pin #23); C 1 T 1662 150; (pin #24); C 1 T 1918 150; (pin #25); ( east side again -- ); C 1 T 2150 800; (pin #26); C 1 T 2150 1100; (pin #27); C 1 T 2150 1400; (pin #28); DF; C 2; E Following is a sample LIST file: <<<< 28P23X34.LIST >>>> 2150, 1700 -- pin #1 -- the substrate connection 2150, 2000 -- pin #2 2150, 2300 -- pin #3 2150, 2600 -- pin #4 1918, 3250 -- pin #5 1662, 3250 -- pin #6 1406, 3250 -- pin #7 1150, 3250 -- pin #8 894, 3250 -- pin #9 638, 3250 -- pin #10 382, 3250 -- pin #11 150, 2600 -- pin #12 150, 2300 -- pin #13 150, 2000 -- pin #14 150, 1700 -- pin #15 150, 1400 -- pin #16 150, 1100 -- pin #17 150, 800 -- pin #18 382, 150 -- pin #19 638, 150 -- pin #20 894, 150 -- pin #21 1150, 150 -- pin #22 1406, 150 -- pin #23 1662, 150 -- pin #24 1918, 150 -- pin #25 2150, 800 -- pin #26 2150, 1100 -- pin #27 2150, 1400 -- pin #28