
\sectioncontents

\section{Component Types}

\begin{slide}

\subsection{Dimensions}
\begin{itemize}
\item standardized
\item depend on individual component specifications
\item JEDEC (Joint Electronic Devices Engineering Council) and others
\item metric or English?!
\end{itemize}

\end{slide}


\begin{slide}

\subsection{Plastic Packages}
\begin{itemize}
\item circuit mounted on lead frame
\item encapsulated with electrically nonconductive plastic
\item plastic withstands soldering temperatures
\end{itemize}

\end{slide}


\begin{slide}

\subsection{PLCC, Plastic Leaded Chip Carrier}
\begin{itemize}
\item "J" leads, bent under package
\item leads take up stress (must not touch package body)
\item nominal lead pitch is 50 mils (0.050 inches)
\item square package specified for 20, 28, 44, 52, 68, 84, 100, 124 terminals

\end{itemize}

\vspace*{1.5in}
\centerline{TI, Page 1-7, Figure 1-5}
\vspace*{1.5in}

\end{slide}


\begin{slide}

\begin{itemize}
\item {rectangular package specified for 18, 22, 28, 32 terminals
	(usually memory)}
\end{itemize}

\vspace*{2in}
\centerline{TI, Page 1-8, Figure 1-6}
\vspace*{2in}

\begin{itemize}
\item thermal resistance similar to DIP
\end{itemize}

\end{slide}


\begin{slide}

\subsection{SOIC, Small Outline IC}
\begin{itemize}
\item small DIP shape
\item 50 mil lead pitch
\item gull-wing leads, sensitive to handling
\item narrow (150 mil) or wide (300 mil) packages
\item available in 8, 14, 16, 20, 24, 28 lead versions
\end{itemize}

\vspace*{1.1in}
\centerline{TI, Page 1-10, Table 1-9}
\vspace*{1.1in}

\begin{itemize}
\item thermal resistance poor (high)
\end{itemize}

\end{slide}


\begin{slide}

\subsection{SOJ, Small Outline J Package}
\begin{itemize}
\item used for high density DRAM
\item "J" leads like PLCC, 20 pins
\item hybrid of SOIC and PLCC
\item space in center for bypass traces
\end{itemize}

\vspace*{1.5in}
\centerline{Prasad, Page 99, Figure 3.22}
\vspace*{1.5in}

\end{slide}


\begin{slide}

\subsection{PQFP}
\begin{itemize}
\item high terminal density
\item small gull wing leads
\item handling difficult
\end{itemize}

\vspace*{1.5in}
\centerline{Prasad, Page 100, Table 3.23}
\vspace*{1.5in}

\end{slide}


\begin{slide}

\subsection{LCCC}
\begin{itemize}
\item primarily for high reliability applications
\item bond using solder fillets in cavities
\item thermal mismatch problems
\end{itemize}

\vspace*{1.5in}
\centerline{TI, Page 1-11, Figures 1-10,11}
\vspace*{1.5in}

\end{slide}


\begin{slide}

\subsection{Ceramic Leaded Chip Carriers}
\begin{itemize}
\item high reliability applications
\item use leads to address thermal problems
\item preleaded or postleaded
\end{itemize}

\vspace*{1.5in}
\centerline{Prasad, Page 86, Figure 3.12}
\vspace*{1.5in}

\end{slide}


\begin{slide}

\subsection{Discrete Semiconductors}
\begin{itemize}
\item variety of sizes, types
\end{itemize}

\vspace*{1.5in}
\centerline{TI, Page 4-5, Figure 4-5}
\vspace*{1.5in}

\end{slide}

