\relax 
\@writefile{toc}{\string\secitem\space {1}{Introduction and Overview}{1}}
\@writefile{toc}{\string\subsecitem\space {1}{Why Surface Mount?}{2}}
\@writefile{toc}{\string\subsecitem\space {1}{Definitions}{9}}
\@writefile{toc}{\string\secitem\space {2}{Surface Mounting: The Short Story}{12}}
\@writefile{toc}{\string\subsecitem\space {2}{Surface Mount Component Preparation}{13}}
\@writefile{toc}{\string\subsecitem\space {2}{Printed Circuit Board Preparation}{14}}
\@writefile{toc}{\string\subsecitem\space {2}{Solder Paste Application}{15}}
\@writefile{toc}{\string\subsecitem\space {2}{Component Placement}{16}}
\@writefile{toc}{\string\subsecitem\space {2}{Soldering}{17}}
\@writefile{toc}{\string\subsecitem\space {2}{Final Steps}{18}}
\@writefile{toc}{\string\secitem\space {3}{Component Types}{20}}
\@writefile{toc}{\string\subsecitem\space {3}{Dimensions}{21}}
\@writefile{toc}{\string\subsecitem\space {3}{Plastic Packages}{22}}
\@writefile{toc}{\string\subsecitem\space {3}{PLCC, Plastic Leaded Chip Carrier}{23}}
\@writefile{toc}{\string\subsecitem\space {3}{SOIC, Small Outline IC}{25}}
\@writefile{toc}{\string\subsecitem\space {3}{SOJ, Small Outline J Package}{26}}
\@writefile{toc}{\string\subsecitem\space {3}{PQFP}{27}}
\@writefile{toc}{\string\subsecitem\space {3}{LCCC}{28}}
\@writefile{toc}{\string\subsecitem\space {3}{Ceramic Leaded Chip Carriers}{29}}
\@writefile{toc}{\string\subsecitem\space {3}{Discrete Semiconductors}{30}}
\@writefile{toc}{\string\secitem\space {4}{History and Other Topics}{32}}
\@writefile{toc}{\string\subsecitem\space {4}{Roots of Surface Mount}{33}}
\@writefile{toc}{\string\subsecitem\space {4}{Early Packaging}{34}}
\@writefile{toc}{\string\subsecitem\space {4}{Early Semiconductors}{34}}
\@writefile{toc}{\string\subsecitem\space {4}{Dual In-line Package (DIP)}{35}}
\@writefile{toc}{\string\subsecitem\space {4}{Flat Packs}{35}}
\@writefile{toc}{\string\subsecitem\space {4}{Hybrid Technology}{36}}
\@writefile{toc}{\string\subsecitem\space {4}{Leadless Ceramic Chip Carriers}{37}}
\@writefile{toc}{\string\subsecitem\space {4}{Small Outline Integrated Circuit}{37}}
\@writefile{toc}{\string\subsecitem\space {4}{Plastic Quad Flat Packs}{38}}
\@writefile{toc}{\string\subsecitem\space {4}{Surface Mount Passive Components}{39}}
\@writefile{toc}{\string\subsecitem\space {4}{Plastic Leaded Chip Carriers}{40}}
\@writefile{toc}{\string\subsecitem\space {4}{Worldwide IC Package Consumption}{41}}
\@writefile{toc}{\string\subsecitem\space {4}{Passive Surface Mount Use}{42}}
\@writefile{toc}{\string\subsecitem\space {4}{Growth of Surface Mount}{43}}
\@writefile{toc}{\string\subsecitem\space {4}{Surface Mount by Market Sector}{44}}
\@writefile{toc}{\string\secitem\space {5}{Mounting Process}{46}}
\@writefile{toc}{\string\subsecitem\space {5}{Component and Board Preparation - Pre-tinning}{47}}
\@writefile{toc}{\string\subsecitem\space {5}{Component and Board Preparation - Board Cleaning}{48}}
\@writefile{toc}{\string\subsecitem\space {5}{Solder Paste}{50}}
\@writefile{toc}{\string\subsecitem\space {5}{Solder Paste Application}{51}}
\@writefile{toc}{\string\subsecitem\space {5}{Screen Printing}{52}}
\@writefile{toc}{\string\subsecitem\space {5}{Mounting Components}{55}}
\@writefile{toc}{\string\subsecitem\space {5}{Reflow Soldering}{57}}
\@writefile{toc}{\string\subsecitem\space {5}{Cleaning}{62}}
\@writefile{toc}{\string\subsecitem\space {5}{Automation}{63}}
\@writefile{toc}{\string\secitem\space {6}{Mixed Component Mounting}{64}}
\@writefile{toc}{\string\subsecitem\space {6}{Sockets}{65}}
\@writefile{toc}{\string\subsecitem\space {6}{Types of Surface Mounting}{66}}
\@writefile{toc}{\string\subsecitem\space {6}{Wave Soldering}{72}}
\@writefile{toc}{\string\secitem\space {7}{Design and Layout Guidelines}{77}}
\@writefile{toc}{\string\subsecitem\space {7}{Board Structure}{78}}
\@writefile{toc}{\string\subsecitem\space {7}{Component Considerations}{80}}
\@writefile{toc}{\string\subsecitem\space {7}{Board Features}{82}}
\@writefile{toc}{\string\subsecitem\space {7}{Land Pattern Considerations}{88}}
\@writefile{toc}{\string\secitem\space {8}{Inspection, Testing, and Repair}{92}}
\@writefile{toc}{\string\subsecitem\space {8}{Inspection}{93}}
\@writefile{toc}{\string\subsecitem\space {8}{Testing}{97}}
\@writefile{toc}{\string\subsecitem\space {8}{Repair}{99}}
\@writefile{toc}{\string\secitem\space {9}{Reliability and Yield}{102}}
\@writefile{toc}{\string\subsecitem\space {9}{Reliability}{103}}
\@writefile{toc}{\string\subsecitem\space {9}{Yield}{104}}
\@writefile{toc}{\string\secitem\space {10}{Conclusion}{105}}