\secitem {1}{Introduction and Overview}{1}
\subsecitem {1}{Why Surface Mount?}{2}
\subsecitem {1}{Definitions}{9}
\secitem {2}{Surface Mounting: The Short Story}{12}
\subsecitem {2}{Surface Mount Component Preparation}{13}
\subsecitem {2}{Printed Circuit Board Preparation}{14}
\subsecitem {2}{Solder Paste Application}{15}
\subsecitem {2}{Component Placement}{16}
\subsecitem {2}{Soldering}{17}
\subsecitem {2}{Final Steps}{18}
\secitem {3}{Component Types}{20}
\subsecitem {3}{Dimensions}{21}
\subsecitem {3}{Plastic Packages}{22}
\subsecitem {3}{PLCC, Plastic Leaded Chip Carrier}{23}
\subsecitem {3}{SOIC, Small Outline IC}{25}
\subsecitem {3}{SOJ, Small Outline J Package}{26}
\subsecitem {3}{PQFP}{27}
\subsecitem {3}{LCCC}{28}
\subsecitem {3}{Ceramic Leaded Chip Carriers}{29}
\subsecitem {3}{Discrete Semiconductors}{30}
\secitem {4}{History and Other Topics}{32}
\subsecitem {4}{Roots of Surface Mount}{33}
\subsecitem {4}{Early Packaging}{34}
\subsecitem {4}{Early Semiconductors}{34}
\subsecitem {4}{Dual In-line Package (DIP)}{35}
\subsecitem {4}{Flat Packs}{35}
\subsecitem {4}{Hybrid Technology}{36}
\subsecitem {4}{Leadless Ceramic Chip Carriers}{37}
\subsecitem {4}{Small Outline Integrated Circuit}{37}
\subsecitem {4}{Plastic Quad Flat Packs}{38}
\subsecitem {4}{Surface Mount Passive Components}{39}
\subsecitem {4}{Plastic Leaded Chip Carriers}{40}
\subsecitem {4}{Worldwide IC Package Consumption}{41}
\subsecitem {4}{Passive Surface Mount Use}{42}
\subsecitem {4}{Growth of Surface Mount}{43}
\subsecitem {4}{Surface Mount by Market Sector}{44}
\secitem {5}{Mounting Process}{46}
\subsecitem {5}{Component and Board Preparation - Pre-tinning}{47}
\subsecitem {5}{Component and Board Preparation - Board Cleaning}{48}
\subsecitem {5}{Solder Paste}{50}
\subsecitem {5}{Solder Paste Application}{51}
\subsecitem {5}{Screen Printing}{52}
\subsecitem {5}{Mounting Components}{55}
\subsecitem {5}{Reflow Soldering}{57}
\subsecitem {5}{Cleaning}{62}
\subsecitem {5}{Automation}{63}
\secitem {6}{Mixed Component Mounting}{64}
\subsecitem {6}{Sockets}{65}
\subsecitem {6}{Types of Surface Mounting}{66}
\subsecitem {6}{Wave Soldering}{72}
\secitem {7}{Design and Layout Guidelines}{77}
\subsecitem {7}{Board Structure}{78}
\subsecitem {7}{Component Considerations}{80}
\subsecitem {7}{Board Features}{82}
\subsecitem {7}{Land Pattern Considerations}{88}
\secitem {8}{Inspection, Testing, and Repair}{92}
\subsecitem {8}{Inspection}{93}
\subsecitem {8}{Testing}{97}
\subsecitem {8}{Repair}{99}
\secitem {9}{Reliability and Yield}{102}
\subsecitem {9}{Reliability}{103}
\subsecitem {9}{Yield}{104}
\secitem {10}{Conclusion}{105}